Lavori attuali relativi a Advanced Packaging Engineer - assago - TDK InvenSense


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    Join to apply for the Advanced Packaging Engineer - Staff role at TDK InvenSense 3 days ago Be among the first 25 applicants Join to apply for the Advanced Packaging Engineer - Staff role at TDK InvenSense Direct message the job poster from TDK InvenSense Founded in 2003, InvenSense Inc., a TDK Group Company, is the world’s leading provider of MEMS sensor...


  • assago, Italia TDK InvenSense A tempo pieno

    Join to apply for the Advanced Packaging Engineer - Staff role at TDK InvenSense3 days ago Be among the first 25 applicantsJoin to apply for the Advanced Packaging Engineer - Staff role at TDK InvenSenseDirect message the job poster from TDK InvenSenseFounded in 2003, InvenSense Inc., a TDK Group Company, is the world’s leading provider of MEMS sensor...

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    Join to apply for the Advanced Packaging Engineer - Staff role at TDK InvenSense3 days ago Be among the first 25 applicantsJoin to apply for the Advanced Packaging Engineer - Staff role at TDK InvenSenseDirect message the job poster from TDK InvenSenseFounded in 2003, InvenSense Inc., a TDK Group Company, is the world's leading provider of MEMS sensor...


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    Assago, Italia Chemelex A tempo pieno

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Advanced Packaging Engineer

10 ore fa


assago, Italia TDK InvenSense A tempo pieno

Join to apply for the Advanced Packaging Engineer - Staff role at TDK InvenSense3 days ago Be among the first 25 applicantsJoin to apply for the Advanced Packaging Engineer - Staff role at TDK InvenSenseDirect message the job poster from TDK InvenSenseFounded in 2003, InvenSense Inc., a TDK Group Company, is the world’s leading provider of MEMS sensor platforms. InvenSense’s vision of Sensing Everything targets the consumer electronics and industrial markets with integrated Motion and Sound solutions. Our solutions combine MEMS (micro electrical mechanical systems) sensors, such as accelerometers, gyroscopes, compasses, and microphones with proprietary algorithms and firmware that intelligently process, synthesize, and calibrate the output of sensors, maximizing performance and accuracy. InvenSense’s motion tracking, audio and location platforms, and services can be found in many of the world’s largest and most iconic brands including smartphones, tablets, wearables, drones, gaming devices, internet of things, automotive products, and remote controls for smart TVs.InvenSense is headquartered in San Jose, CA, and has offices in Boston, China, Taiwan, Korea, Japan, France, Canada, Slovakia, and Italy. We’re looking for top-notch innovators to join our global team. If you’re interested in being a part of our journey and helping us grow to become the leading provider of SoC platform solutions, we want to hear from you.About the RoleWork in the TDK InvenSense Core Technology Packaging team providing leadership in the areas of package simulation and module level analysis supporting NPI assembly and technology development for all our motion products. The scope of work includes 3D model generation, material characterization, mechanical simulations (static, dynamic, linear, non-linear analyses), thermal and thermomechanical simulations, electromagnetic and coupled Multiphysics simulations. You will be expected to work closely with MEMS design, assembly and validation teams to explore new materials and new assembly methods for MEMS motion sensors. The job will involve close interaction with cross-functional teams across the company, overseas manufacturing houses (OSATs), and as well as close interactions with internal & external customers.Job QualificationsMS or Ph.D. in Mechanical Engineering, Electrical or MEMS Engineering, Physics, or similar discipline5+ years of experience with simulation in the field of MEMS, ideally MEMS packaging (e.g. accelerometer, gyroscope, microphone, and magnetometer)Strong expertise in FEM/cross domain/multiphysics simulations (e.g. die/package/socket interactions, thermo-mechanical and electromagnetic simulations)Strong skills in using modeling and simulation, programming and 2D/3D CAD software tools (Ex: Ansys, Comsol, APDL, Matlab, Python, AutoCAD, SolidWorks, Inventor)Ability to analyze/validate, interpret and effectively communicate simulation results to stakeholders both verbally and in presentationsBroad knowledge of semiconductor/MEMS materials (including characterization), microelectronics and assembly processesPrefer experience working with suppliers/OSATs, NPI, in high volume manufacturing environmentPrefer working knowledge of statistical process control and statistical tolerance analysesAbility to work in an internationally distributed, fast-paced, product focused environmentPossible locations: Milan (Assago), Munich.Seniority levelSeniority levelAssociateEmployment typeEmployment typeFull-timeJob functionJob functionResearch and EngineeringIndustriesSemiconductor ManufacturingReferrals increase your chances of interviewing at TDK InvenSense by 2xSign in to set job alerts for “Packaging Engineer” roles.Mechanical Design Engineer - Packaging Food & PharmaR&D Packaging Sustainability & Compliance Senior SpecialistQC and Packaging Development Senior SpecialistStrategic Account Manager - Packaging AdhesivesPRODUCTION PLANNER SETTORE PACKAGING/CARTOTECNICO - MAGENTANovate Milanese, Lombardy, Italy 2 weeks agoProject & Process Engineer - Chimica SemiconduttoriProcess Engineer - Dry Anaerobic DigestionItaly Internship Supply Chain Process Engineer AssistantProcess Engineer - (Offshore) - Energy, Oil & Gas ProjectWe’re unlocking community knowledge in a new way. Experts add insights directly into each article, started with the help of AI.#J-18808-Ljbffr