Expert on Printed Circuit Boards Technology for High-speed Applications
4 settimane fa
OverviewExpert on Printed Circuit Boards Technology for High-speed Applications— Huawei Italy Research Centers. This role focuses on leading the innovation of PCB technology and related manufacturing processes to support high-speed interconnection scenarios. What will be your main responsibilities?Support the Lab by identifying feasible technologies, materials and industrial process limitations to improve PCBs in terms of signal routing density, insertion loss, maximum bandwidth and overall reliability for high-speed interconnection scenarios. Develop novel technologies (with support from identified technical partners) to facilitate integration of complex systems with multiple interconnected modules/packages, addressing mechanical stability, interconnections optimization, bandwidth and insertion loss minimization. Collaborate with the EM modelling team and the RF design team within the Board and Module Engineering Lab to drive innovative technical solutions considering engineering constraints. Stay up to date with the state of the art of high-frequency, high-speed PCB technology by attending technical conferences, meeting industry experts, and reporting insights to the Lab Director and Business Unit on advancements and breakthroughs. Lead the development of technology roadmaps and provide technical insights for innovative PCB technology, addressing novel industrial processes, materials and integration technologies to ensure ongoing evolution of PCBs in board-level architectures and leadership in power and computing performance for HPC interconnection scenarios. What are the skills required for this position?Over 5 years of experience in PCB-related technology, with a focus on high-speed and high-frequency applications. In-depth knowledge of the manufacturing process of high-precision, multilayer, multi-substrate PCBs and related technical challenges. In-depth knowledge of materials and packaging techniques for high-speed applications (e.g., glass, polymers) and related industrial processes and challenges. What We OfferWe offer an exciting professional career in a leading multinational telecommunications company, with challenging work and a competitive salary package. Personal development is supported through many training opportunities in Western Europe and abroad. Contract Type1-year temporary contract with our outsourcing partner Randstad Italia, with the possibility of long-term employment afterwards. Privacy StatementWe commit to protecting your privacy following local legal data privacy legislation. Please read the West European Recruitment Privacy Notice before submitting your personal data to Huawei to understand how we process and manage your data: . If you have any queries regarding Huawei WEU Data Privacy, please contact the WEU Data Protection Officer: . Company InfoHuawei Technologies Italia S.r.l. — Registered Office: Via Lorenteggio 240, Tower A, Milan. R&D Office address: Viale Martesana 12, 20055 Vimodrone (MI). Seniority levelMid-Senior level Employment typeFull-time Job functionOther IndustriesTechnology, Information and Internet#J-18808-Ljbffr
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