Photonics Packaging Engineer

3 settimane fa


Pisa, Italia IC Resources A tempo pieno

Photonics Packaging Engineer IC Resources is looking for a Packaging Engineer experienced in photonic and optoelectronic devices to join their R&D team, onsite in Italy. Contact Ella Flynn at IC Resources for more information. Responsibilities Design and develop photonic and optoelectronic packaging solutions Create mechanical and optical component layouts Support micro‑optical and fibre‑optic assembly processes Engage in semiconductor assembly processes Must Haves Master’s degree in Physics, Electronics Engineering or a related field Knowledge of semiconductor, photonics packaging, micro‑optical assembly processes Experience with CAD design tools (e.g., SolidWorks) Good to Have Understanding of PICs Experience in cleanroom and advanced packaging technologies Seniority level Entry level Employment type Full-time Job function Engineering and Information Technology Industries Staffing and Recruiting #J-18808-Ljbffr



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