Staff MEMS Packaging Engineer: Lead Simulations
3 giorni fa
Assago, Lombardia, Italia
TDK InvenSense
Tempo pieno
50.000 € - 70.000 € Contratto
Gratuito con email o Google
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A global semiconductor company in Assago is seeking an Advanced Packaging Engineer
- Staff. You will lead simulation and analysis efforts for MEMS motion products, requiring expertise in FEM simulations and collaboration with cross-functional teams. Ideal candidates hold an MS or Ph.
D., with 5+ years in MEMS packaging. Strong communication and knowledge of semiconductor materials are essential. This full-time role supports innovation in a dynamic environment.
- Staff. You will lead simulation and analysis efforts for MEMS motion products, requiring expertise in FEM simulations and collaboration with cross-functional teams. Ideal candidates hold an MS or Ph.
D., with 5+ years in MEMS packaging. Strong communication and knowledge of semiconductor materials are essential. This full-time role supports innovation in a dynamic environment.