Staff MEMS Packaging Engineer: Lead Simulations

3 giorni fa

Assago, Lombardia, Italia TDK InvenSense Tempo pieno 50.000 € - 70.000 € Contratto
A global semiconductor company in Assago is seeking an Advanced Packaging Engineer
- Staff. You will lead simulation and analysis efforts for MEMS motion products, requiring expertise in FEM simulations and collaboration with cross-functional teams. Ideal candidates hold an MS or Ph.
D., with 5+ years in MEMS packaging. Strong communication and knowledge of semiconductor materials are essential. This full-time role supports innovation in a dynamic environment.