Package Designer

**OUR STORY**

At ST, we believe in the power of technology to drive innovation and make a positive impact on people, business, and society. We are a global semiconductor company, and our advanced technology & chips forms the hidden part of the world we live in today.

When you join ST, you will be part of a global business of more than 115+ nationalities and present in 40 countries, 50,000+, diverse and dedicated creators & makers of technology around the world

Developing technologies takes more than talent: it takes amazing people who understands collaboration and respect. People with passion and desire to disrupt the status quo, push boundaries and drive innovation - whilst unlocking your own potential.

Working at ST means innovating for a future that we want to make smarter, greener, in a responsible and sustainable way. Our technology starts with you. Join us and start the future

**YOUR ROLE**

As part of BEM&T (Back End Manufacturing & Technology), the Package R&D is in charge of developing new packages for integrated circuits and related assembly technologies; within Package R&D Team, the package designer has the responsibility to design a new package and lead its development from technical viewpoint in cooperation with other Package R&D functions.

With the goal to reinforce the team dedicated to QFN package platform, we are looking for a dynamic engineer whose responsibilities will include:

- Design the new requested package according to the established design rules to fulfill the customer's requirements in term of quality, timing and cost.
- Act as Technical Project Leader leading the technical project content in coordination with the assigned Program Manager.
- Work in synergy with:

- Technology Engineering team for package materials selection and the development or validation of assembly technologies.
- Material Characterization & Measurement Lab for package related stress test, package characterization and relevant measurements
- Interface with internal & external customer, assembly plants and central functions during the project execution through the maturity steps of package development process from feasibility to release to production.
- Attend and drive on regular basis meetings/calls to update the stakeholders about the project progress

**YOUR SKILLS & EXPERIENCES**
- Bachelor/Master degree in Mechanical Engineering or similar
- Proficiency in the use of Autodesk AutoCAD and Inventor
- Proficiency in the use of Microsoft Office suite
- Excellent problem-solving and analytical skills
- Strong communication and teamwork abilities
- Good attitude to interpersonal relationship
- Ability to manage multiple tasks and prioritize effectively in a dynamic environment
- Previous experience in similar role is a plus
- Knowledge of semiconductor packaging is a plus
- Fluent in English

Joining us is also about a greater work-life balance and workplace with equal opportunities. Dedicated Employee Resource Groups for women and LGBTQIA+, hybrid work arrangements are amongst the many DEI & Sustainability initiatives that make us a great place to evolve your career.