Product Marketing Manager 3

Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies across the semiconductor value chain to help customers solve yield, device performance, quality, and reliability issues.Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster and more efficient.Job SummaryYou will lead product marketing for Onto Innovation’s FAaST® CV/IV, CnCV®, and MBIR (Model‑Based Infrared Reflectometry) product lines—Semilab’s flagship metrology platforms now part of Onto’s portfolio—serving advanced logic/memory, advanced packaging (including AI‑enabling flows), and power semiconductor segments.You’ll build compelling positioning and go‑to‑market programs that highlight non‑contact electrical characterization, wide bandgap (SiC/GaN) interface metrology, and high‑aspect‑ratio 3D structure control to drive fab adoption and measurable yield/COO impact.Why This Role MattersFAaST delivers non‑contact CV/IV metrology using patented corona‑Kelvin methods to quantify dielectric and interface properties—enabling fast, device‑free feedback on EOT, leakage, flatband voltage, traps (Dit), mobile ions, and plasma damage/NVD mapping.CnCV® extends non‑contact CV into wide bandgap materials with photo‑assisted techniques for deep interface traps and robust dopant profiling—reducing test cost and time while improving process control for SiC/GaN and HEMT structures.MBIR enables high‑throughput, non‑destructive IR reflectometry to control 3D‑etched structures (trenches, TSVs, capacitors), film thickness/composition, and epitaxial layers—even at small spot size suitable for scribe lines.Together, these tools strengthen Onto’s materials characterization suite and complement defect/OCD capabilities across growth segments.Key ResponsibilitiesMarket & Competitive StrategyMap the competitive landscape and positioning of FAaST®, CnCV®, and MBIR across electrical metrology and optical IR reflectometry for front‑end, middle‑of‑line, and advanced packaging process steps.Quantify ROI tied to yield, cycle‑time, and cost‑of‑ownership improvements in advanced logic/memory, AI‑oriented packaging, and power devices; build segment playbooks by node and device class.Product Positioning & MessagingDevelop differentiation that spotlights FAaST’s non‑contact dielectric/interface electrical metrics, CnCV’s WBG interface/deep‑trap characterization & dopant profiling, and MBIR’s 3D geometry/film stack modeling advantages.Craft sector‑specific messaging for SiC/GaN, wafer bumping/advanced packaging, and high‑aspect‑ratio memory/logic features, emphasizing device‑free monitoring and scribe‑line control.Go‑to‑Market PlanningDrive launches with webinars, technical briefs, sales training, and targeted campaigns that translate metrology outputs into fab‑level outcomes (yield, throughput, COO).Equip field teams to articulate how non‑contact electrical metrology (FAaST/CnCV) and IR reflectometry (MBIR) accelerate ramp, qualify new materials, and de‑risk advanced packaging flows.Sales Enablement & Field SupportBuild data‑driven toolkits: FAaST CV/IV/NVD maps; CnCV QUAD/defect imaging and doping depth profiles for WBG; MBIR trench/film thickness maps and model recipes.Provide ROI calculators and application playbooks for contamination monitoring (DSPV/FAaST), interface reliability (BTS via CnCV), and 3D‑structure control (MBIR).Coordinate participation at SEMICON and fab‑focused panels to showcase competitive advantages and customer case studies.Cross‑functional CollaborationAlign with R&D/Product Management to feed market insights into roadmap priorities (e.g., CnCV kinetic/UV‑assisted modes; MBIR model libraries).Partner with Marketing Communications to deliver thought leadership—application notes, proof‑of‑concept data, and WBG/advanced packaging success stories.QualificationsTechnical Foundation5+ years in semiconductor process control or metrology; hands‑on exposure to non‑contact corona‑Kelvin CV/IV and/or IR reflectometry for device‑free characterization.Experience with SiC/GaN and WBG interfaces, deep trap characterization, and dopant profiling using photo‑assisted CnCV techniques.Deep Product ExpertiseFamiliarity with FAaST® platforms (CV/IV, DSPV/NVD), CnCV® (QUAD/EDI, TSEC, BTS), and MBIR system concepts (FTIR‑based reflectometry, EMA/Rigorous modeling).Ability to translate system‑level outputs into fab‑level outcomes (yield, throughput, cost of ownership) for advanced logic/memory, packaging, and power.Go‑To‑Market OrientationProven success in product launches, technical collateral, and enabling global field sales for complex semiconductor metrology equipment.Excellent communicator with proficiency in live demos, webinars, case studies, and conference presentations.Analytical & Strategic ThinkerStrong command of market sizing, ROI/COO analysis, competitive intelligence, and customer profiling; adept at turning technical specs into clear differentiators.Collaborative & Results‑DrivenEffective collaborator across Sales, R&D, Ops, and Customer Success—goal and timeline focused, able to drive alignment and deliver high‑impact results on schedule.Onto Innovation Inc. offers competitive salaries and a generous benefits package, including health/dental/vision/life/disability, PTO, 401K plan with employer match, and an Employee Stock Purchase Program (ESPP) along with health & wellness initiatives. We provide a collaborative working environment along with resources, and state‑of‑the‑art tools & equipment to promote success; and a welcoming, inclusive corporate culture where individuals are recognized for their contributions.Onto Innovation Inc. is an Equal Opportunity Employer and all qualified applicants will receive consideration for employment without regard to race, color, religion, gender, sexual orientation, national origin, genetic information, age, disability, veteran status, or any other legally protected basis.For positions requiring access to technical data, Onto Innovation Inc., Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls. As such, applicants for this position – except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) – may have to go through an export licensing review process.#J-18808-Ljbffr