Staff MEMS Packaging Engineer: Lead Simulations

1 giorno fa

Assago, Lombardy, Italia TDK InvenSense Tempo pieno 50.000 € - 70.000 € Contratto
A global semiconductor company in Assago is seeking an Advanced Packaging Engineer

Non aspetti a candidarsi dopo aver letto questa descrizione: per questa opportunità è previsto un elevato volume di candidature.
- Staff.

You will lead simulation and analysis efforts for MEMS motion products, requiring expertise in FEM simulations and collaboration with cross-functional teams.

Ideal candidates hold an MS or Ph.D., with 5+ years in MEMS packaging.

Strong communication and knowledge of semiconductor materials are essential. xbvzest

This full-time role supports innovation in a dynamic environment.