Package Design

OUR STORY
At STMicroelectronics, we believe in the power of technology to drive innovation and make a positive impact on people, businesses, and society. As a global semiconductor company, our advanced technologies and chips form the hidden foundation of the world we live in today.
When you join ST, you will be part of a global business with more than 115 nationalities, present in 40 countries, and comprising over 50,000 diverse and dedicated creators and makers of technology around the world.
Developing technologies takes more than talent: it takes amazing people who understand collaboration and respect. People with passion and the desire to disrupt the status quo, drive innovation, and unlock their own potential.
Embark on a journey with us, where you can innovate for a future that we want to make smarter and greener, in a responsible and sustainable way. Our technology starts with you.
YOUR ROLE
As a member of the MEMS sensor package design team, you will support and coordinate the package industrialization process from initial concept validation through to mass production release. Your role will encompass managing cross-functional collaboration, driving project milestones, and ensuring alignment between design, manufacturing, and quality objectives.

Key Responsibilities Include

• Oversee and drive the industrialization for MEMS sensor packages, ensuring timely progression through concept, pilot, and mass production phases.
• Coordinate closely with internal ST teams and external manufacturing partners to evaluate advanced package designs, assess process feasibility, and mitigate risks related to sensor and ASIC integration.
• Manage technical investigations on the interaction between package features and sensing elements, defining action plans to minimize mutual impact and optimize performance.
• Leverage 3D CAD tools and design guidelines to support mechanical validation and control of non-standard package geometries, ensuring compliance with project requirements and manufacturability standards.
• Facilitate communication and alignment across multidisciplinary teams including R&D, process engineering, quality, and supply chain to ensure seamless project execution.

Experience & Qualifications

• Master's degree in Mechanical, Materials, Physics Engineering, or related STEM discipline, complemented by hands-on experience in semiconductor package design or process development.
• 3 to 5 years of technical experience in semiconductor packaging or related fields.
• 1 to 3 years of experience in project or program management
• Proficiency in 2D and 3D CAD tools to support design review and technical discussions.
• Solid understanding of materials and processes used in semiconductor packaging.
• Strong business-level English communication skills to effectively engage with global teams and partners.

ST is proud to be one of the 17 companies certified as a 2025 Global Top Employer and the first and only semiconductor company to achieve this distinction. ST was recognized in this ranking thanks to its continuous improvement approach and stands out particularly in the areas of ethics & integrity, purpose & values, organization & change, business strategy, and performance.

At ST, we endeavor to foster a diverse and inclusive workplace, and we do not tolerate discrimination. We aim to recruit and retain a diverse workforce that reflects the societies around us. We strive for equity in career development, career opportunities, and equal remuneration. We encourage candidates who may not meet every single requirement to apply, as we appreciate diverse perspectives and provide opportunities for growth and learning. Diversity, equity, and inclusion (DEI) is woven into our company culture.

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