High-Speed Interconnects: Computational EM Engineer

Huawei Technologies Italia S.r.l. (CHEI at Huawei Milan Research Center) seeks engineers to turn advanced numerical techniques into practical software for high-speed interconnect design.You will develop computational EM models, engineer reusable workflows, and collaborate with hardware teams worldwide to accelerate hardware development. The role emphasizes...

The Central Hardware Engineering Institute (CHEI) at Huawei Milan Research Center develops advanced computational methods and engineering technologies for next-generation ICT systems. Our work combines computational electromagnetics, numerical algorithms, software engineering, and high-speed interconnect design to create reusable methodologies that...

Advanced Fiber Resources in San Donato Milanese is expanding its PIC development center and seeks an expert Packaging Engineer to join a growing team. You will design and develop optical/electro-optical packaging solutions for telecom, datacom and quantum photonics applications, collaborating across international teams. We value 5+ years in relevant roles,...

Advanced Fiber Resources in San Donato Milanese is expanding its PIC development center and seeks an expert Packaging Engineer to join a growing team. You will design and develop optical/electro-optical packaging solutions for telecom, datacom and quantum photonics applications, collaborating across international teams. We value 5+ years in relevant roles,...

Advanced Fiber Resources (AFR) in San Donato Milanese is seeking an expert Packaging Engineer to join our R&D and Manufacturing Center. You will develop thin-film Lithium Niobate components for telecom, datacom and quantum photonics. You will own packaging design from concept to production, address optical coupling, thermal management and high-frequency...

2D Photonics in Pisa and Milano area seeks an experienced Analog IC Design Engineer to advance high-speed SerDes silicon IP for ultra-high bandwidth optical interconnects in AI and data transfer applications.You will design analog/mixed-signal circuits, PLLs, DLLs, CTLE/DFE/FFE, and support bring-up from concept to product. Requires 8+ years in high-speed...

2D Photonics in Pisa and Milano area seeks an experienced Analog IC Design Engineer to advance high-speed SerDes silicon IP for ultra-high bandwidth optical interconnects in AI and data transfer applications. You will design analog/mixed-signal circuits, PLLs, DLLs, CTLE/DFE/FFE, and support bring-up from concept to product. Requires 8+ years in high-speed...

2D Photonics in Pisa and Milano area seeks an experienced Analog IC Design Engineer to advance high-speed SerDes silicon IP for ultra-high bandwidth optical interconnects in AI and data transfer applications. You will design analog/mixed-signal circuits, PLLs, DLLs, CTLE/DFE/FFE, and support bring-up from concept to product. Requires 8+ years in high-speed...

At 2D Photonics and CamGraPhIC we develop ultra-high bandwidth, low-latency optical interconnects for generative AI, cellular, and high-bandwidth data transfer applications. Our Graphene Integrated Photonics (GIP) offers superior capabilities for next-generation transceivers. The way we incorporate graphene with silicon photonics preserves its unique...