Photonics Packaging Engineer for High-Speed Optics

ams OSRAM's LSP unit seeks a senior validation engineer to lead RF, HF, analog, mixed-signal, and high-speed digital IC validation. You will develop validation plans, characterize performance across process, voltage, and temperature, and drive root-cause analysis for silicon issues.You will collaborate with architecture, design, verification, and...

ams OSRAM's LSP unit seeks a senior validation engineer to lead RF, HF, analog, mixed-signal, and high-speed digital IC validation. You will develop validation plans, characterize performance across process, voltage, and temperature, and drive root-cause analysis for silicon issues.You will collaborate with architecture, design, verification, and...

AFR is investing in its PIC business by expanding the R&D and Manufacturing Center in San Donato Milanese.We are looking for an expert Packaging Engineer to join our growing development team. You will have the opportunity to work with skillful and highly motivated engineers developing thin film Lithium Niobate products for telecom, datacom and quantum...

ams OSRAM's LSP unit seeks a senior validation engineer to lead RF, HF, analog, mixed-signal, and high-speed digital IC validation. You will develop validation plans, characterize performance across process, voltage, and temperature, and drive root-cause analysis for silicon issues.You will collaborate with architecture, design, verification, and...

AFR is investing in its PIC business by expanding the R&D and Manufacturing Center in San Donato Milanese.We are looking for an expert Packaging Engineer to join our growing development team. You will have the opportunity to work with skillful and highly motivated engineers developing thin film Lithium Niobate products for telecom, datacom and quantum...

AFR is investing in its PIC business by expanding the R&D and Manufacturing Center in San Donato Milanese.We are looking for an expert Packaging Engineer to join our growing development team. You will have the opportunity to work with skillful and highly motivated engineers developing thin film Lithium Niobate products for telecom, datacom and quantum...

The Central Hardware Engineering Institute (CHEI) at Huawei Milan Research Center develops advanced computational methods and engineering technologies for next-generation ICT systems. Our work combines computational electromagnetics, numerical algorithms, software engineering, and high-speed interconnect design to create reusable methodologies that...

Overview As a Silicon Photonics Design Engineer, you will help develop silicon photonics IC-based products from design to fabrication and testing. You will work with a multidisciplinary team to deliver innovative photonic devices and large-scale circuits, shaping photonics-enabled connectivity. The role emphasizes cross-functional collaboration to meet...

microTECH Global Limited is seeking a High Speed Signal Integrity Engineer in Milan, Italy, to own end-to-end SI analysis across the design stack and drive methodologies for high-speed interconnects. You will optimise PCB, package, and interconnect performance while developing automation tools to improve team efficiency.Ideal candidates bring a strong...