IC Package Layout Engineer

7 ore fa

Asti, Piedmont, Italia Amazon Inc. Tempo pieno

Annapurna Labs in AWS seeks a Package Layout Design Engineer to contribute to the physical design of advanced IC packages for AI/ML and data center ASICs. You will drive floorplanning, routing, and tape-out coordination with ASIC, SI/PI, and manufacturing teams.

Lead aspects of 2.5D/3D-IC packaging, interposer design, and DFM compliance while advancing density, performance, and reliability targets in a fast-paced hardware environment.