electronics
Vedi stipendio medio di electronics »
10.000 offerte di lavoro electronics in Italia. Offerte aggiornate quotidianamente.
-
Electronics Engineer
2 giorni fa
trieste, Italia Ephos Tempo pienoEphos is building vertically integrated, advanced packaging solutions on glass panels. We transform raw glass into electronic and optically active substrates for die-to-die connectivity, manufactured entirely within our own facilities. Our systems are built for companies developing AI accelerators, including hyperscalers and top-tier chip designers. We have...
-
Electronics Engineer
2 giorni fa
cremona, Italia Ephos Tempo pienoEphos is building vertically integrated, advanced packaging solutions on glass panels. We transform raw glass into electronic and optically active substrates for die-to-die connectivity, manufactured entirely within our own facilities. Our systems are built for companies developing AI accelerators, including hyperscalers and top-tier chip designers. We have...
-
Electronics Engineer
2 giorni fa
cagliari, Italia Ephos Tempo pienoEphos is building vertically integrated, advanced packaging solutions on glass panels. We transform raw glass into electronic and optically active substrates for die-to-die connectivity, manufactured entirely within our own facilities. Our systems are built for companies developing AI accelerators, including hyperscalers and top-tier chip designers. We have...
-
Electronics Engineer
2 giorni fa
caserta, Italia Ephos Tempo pienoEphos is building vertically integrated, advanced packaging solutions on glass panels. We transform raw glass into electronic and optically active substrates for die-to-die connectivity, manufactured entirely within our own facilities. Our systems are built for companies developing AI accelerators, including hyperscalers and top-tier chip designers. We have...
-
Electronics Engineer
2 giorni fa
roma, Italia Ephos Tempo pienoEphos is building vertically integrated, advanced packaging solutions on glass panels. We transform raw glass into electronic and optically active substrates for die-to-die connectivity, manufactured entirely within our own facilities. Our systems are built for companies developing AI accelerators, including hyperscalers and top-tier chip designers. We have...
-
Electronics Engineer
2 giorni fa
brescia, Italia Ephos Tempo pienoEphos is building vertically integrated, advanced packaging solutions on glass panels. We transform raw glass into electronic and optically active substrates for die-to-die connectivity, manufactured entirely within our own facilities. Our systems are built for companies developing AI accelerators, including hyperscalers and top-tier chip designers. We have...
-
Electronics Engineer
2 giorni fa
napoli, Italia Ephos Tempo pienoEphos is building vertically integrated, advanced packaging solutions on glass panels. We transform raw glass into electronic and optically active substrates for die-to-die connectivity, manufactured entirely within our own facilities. Our systems are built for companies developing AI accelerators, including hyperscalers and top-tier chip designers. We have...
-
Electronics Engineer
2 giorni fa
milano, Italia Ephos Tempo pienoEphos is building vertically integrated, advanced packaging solutions on glass panels. We transform raw glass into electronic and optically active substrates for die-to-die connectivity, manufactured entirely within our own facilities. Our systems are built for companies developing AI accelerators, including hyperscalers and top-tier chip designers. We have...
-
Electronics Engineer
2 giorni fa
asti, Italia Ephos Tempo pienoEphos is building vertically integrated, advanced packaging solutions on glass panels. We transform raw glass into electronic and optically active substrates for die-to-die connectivity, manufactured entirely within our own facilities. Our systems are built for companies developing AI accelerators, including hyperscalers and top-tier chip designers. We have...
-
Electronics Engineer
2 giorni fa
siena, Italia Ephos Tempo pienoEphos is building vertically integrated, advanced packaging solutions on glass panels. We transform raw glass into electronic and optically active substrates for die-to-die connectivity, manufactured entirely within our own facilities. Our systems are built for companies developing AI accelerators, including hyperscalers and top-tier chip designers. We have...
-
Electronics Engineer
2 giorni fa
frosinone, Italia Ephos Tempo pienoEphos is building vertically integrated, advanced packaging solutions on glass panels. We transform raw glass into electronic and optically active substrates for die-to-die connectivity, manufactured entirely within our own facilities. Our systems are built for companies developing AI accelerators, including hyperscalers and top-tier chip designers. We have...
-
Electronics Engineer
2 giorni fa
modena, Italia Ephos Tempo pienoEphos is building vertically integrated, advanced packaging solutions on glass panels. We transform raw glass into electronic and optically active substrates for die-to-die connectivity, manufactured entirely within our own facilities. Our systems are built for companies developing AI accelerators, including hyperscalers and top-tier chip designers. We have...
-
Electronics Engineer
2 giorni fa
bari, Italia Ephos Tempo pienoEphos is building vertically integrated, advanced packaging solutions on glass panels. We transform raw glass into electronic and optically active substrates for die-to-die connectivity, manufactured entirely within our own facilities. Our systems are built for companies developing AI accelerators, including hyperscalers and top-tier chip designers. We have...
-
Electronics Engineer
2 giorni fa
udine, Italia Ephos Tempo pienoEphos is building vertically integrated, advanced packaging solutions on glass panels. We transform raw glass into electronic and optically active substrates for die-to-die connectivity, manufactured entirely within our own facilities. Our systems are built for companies developing AI accelerators, including hyperscalers and top-tier chip designers. We have...
-
Electronics Engineer
2 giorni fa
ravenna, Italia Ephos Tempo pienoEphos is building vertically integrated, advanced packaging solutions on glass panels. We transform raw glass into electronic and optically active substrates for die-to-die connectivity, manufactured entirely within our own facilities. Our systems are built for companies developing AI accelerators, including hyperscalers and top-tier chip designers. We have...
-
Electronics Engineer
2 giorni fa
como, Italia Ephos Tempo pienoEphos is building vertically integrated, advanced packaging solutions on glass panels. We transform raw glass into electronic and optically active substrates for die-to-die connectivity, manufactured entirely within our own facilities. Our systems are built for companies developing AI accelerators, including hyperscalers and top-tier chip designers. We have...
-
Electronics Engineer
2 giorni fa
novara, Italia Ephos Tempo pienoEphos is building vertically integrated, advanced packaging solutions on glass panels. We transform raw glass into electronic and optically active substrates for die-to-die connectivity, manufactured entirely within our own facilities. Our systems are built for companies developing AI accelerators, including hyperscalers and top-tier chip designers. We have...
-
Electronics Engineer
2 giorni fa
ferrara, Italia Ephos Tempo pienoEphos is building vertically integrated, advanced packaging solutions on glass panels. We transform raw glass into electronic and optically active substrates for die-to-die connectivity, manufactured entirely within our own facilities. Our systems are built for companies developing AI accelerators, including hyperscalers and top-tier chip designers. We have...
-
Electronics Engineer
2 giorni fa
perugia, Italia Ephos Tempo pienoEphos is building vertically integrated, advanced packaging solutions on glass panels. We transform raw glass into electronic and optically active substrates for die-to-die connectivity, manufactured entirely within our own facilities. Our systems are built for companies developing AI accelerators, including hyperscalers and top-tier chip designers. We have...
-
Electronics Engineer
2 giorni fa
livorno, Italia Ephos Tempo pienoEphos is building vertically integrated, advanced packaging solutions on glass panels. We transform raw glass into electronic and optically active substrates for die-to-die connectivity, manufactured entirely within our own facilities. Our systems are built for companies developing AI accelerators, including hyperscalers and top-tier chip designers. We have...