Mechanical Engineer Space Electronics Assemblies

3 giorni fa

Milano, Lombardia, Italia Aresys A tempo pieno

ARESYS

Published

4 February 2026

Location

Milan, Italy

Category

Engineering

Job Type

Full-time

Description
ARESYS
is an Italian SME providing innovative satellite-based sensingsolutions to the
Space and Defense
markets.

ARESYS
offers a 20+ years of expertise in designing and developing
on-board
and
on-ground
systems with a vertical specialization in
microwawe
(
Radar, SAR) and Optical
technologies.

We are seeking a skilled
Mechanical Engineer
to join our team and contribute to the design and integration of mechanical structures for space electronic assemblies, including housings, enclosures, thermal interfaces, mechanical supports, and brackets.

The ideal candidate will have hands-on experience in the
design of hardware for harsh environments
(space vacuum, vibration, thermal extremes) and will work in close collaboration with electronics, thermal, and systems engineering teams.

Main Tasks And Responsibilities

  • 3D 2D mechanical design of structures and interfaces for space-grade electronic units (boxes, heatsinks, mounting interfaces, connector panels, etc.).
  • Creation of mechanical drawings and technical documentation (BoMs, manufacturing drawings, tolerances, DFM considerations).
  • Collaboration with electronic designers to ensure proper mechanical and thermal integration of PCBs, connectors, and shields.
  • Material selection and specification of finishes treatments suitable for space (e.g., low-outgassing, CTE compatibility, corrosion resistance).
  • Liaising with suppliers, mechanical workshops, and prototyping partners.
  • Participation in environmental testing campaigns (vibration, TVAC, shock), including mechanical test setup preparation.
  • Contribution to technical design reviews (PDR, CDR) and product configuration control.

Required Skills

  • Familiarity with space-related norms and standards (ECSS preferred).
  • Proficient in 3D CAD modeling and 2D drawing generation.
  • Basic knowledge of structural and thermal simulation tools (FEA FEM).
  • Understanding of thermal, EMC, and mechanical constraints in electronic packaging.
  • Experience designing for harsh environments (low mass, high vibration, thermal gradients, radiation).

As a Plus

  • Experience with real space missions (e.g., CubeSat, SmallSat, satellite payloads).
  • Knowledge of ECSS standards (e.g., ECSS-E-ST-32, ECSS-Q-ST-70).
  • Experience with FEA tools (e.g., ANSYS, COMSOL, NASTRAN).
  • Familiarity with documentation workflows for ESA NASA missions.

Soft-skills

  • High attention to detail, autonomy, and practical problem-solving.
  • Ability to work in multidisciplinary teams.

Your Background

  • Master's degree in Mechanical Engineering or equivalent.
  • Minimum 3 years of experience in mechanical design of electronic systems (ideally in space, aerospace, or high-end automotive sectors).
  • Good communication skills in English (B2 or higher)

What We Offer

  • Involvement in cutting-edge projects in the aerospace domain.
  • Collaborative and highly technical environment.
  • Opportunities for professional growth and specialization in space-grade mechanical design.
  • Competitive compensation aligned with experience

Our organization operates in accordance with gender equality and is committed to supporting inclusivity and diversity.

Please submit your application without providing information about marriage, pregnancy, or family responsibilities.

Applications must not contain information about the family status of candidates or any pregnancy.

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