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Photonics Packaging Engineer
46 minuti fa
Our international start-up client is currently seeking an Engineer with experience in the packaging of photonic and optoelectronic devices to join the R&D team. The successful candidate will be responsible for the design, assembly, and optimisation of advanced photonic packaging solutions, contributing directly to the development of next-generation photonic systems. The ideal candidate combines strong technical expertise in photonics packaging and semiconductor assembly with excellent communication and teamwork skills, and thrives in a collaborative, cross-functional environment. This position is suited for an engineer with some professional experience who is motivated to grow within a multidisciplinary team.
Required Skills For The Photonic Packaging Engineering Will Include
- Knowledge of semiconductor and photonics packaging concepts
- Familiarity with semiconductor assembly processes, including flip-chip and wire-bonding manufacturing flows
- Experience working in a cleanroom or precision assembly environment
- Strong verbal and written communication skills
- Master's degree in physics, Electrical Engineering, Electronics Engineering, or related field
Please contact Rachel Anderson for further details.
