Advanced Packaging Engineer

2 settimane fa

Assago, Italia TDK InvenSense A tempo pieno

About the Company

Founded in 2003, InvenSense Inc., a TDK Group Company, is the world's leading provider of MEMS sensor platforms. InvenSense's vision of Sensing Everything targets the consumer electronics and industrial markets with integrated Motion and Sound solutions. Our solutions combine MEMS (micro electrical mechanical systems) sensors, such as accelerometers, gyroscopes, compasses, and microphones with proprietary algorithms and firmware that intelligently process, synthesize, and calibrate the output of sensors, maximizing performance and accuracy. InvenSense's motion tracking, audio and location platforms, and services can be found in many of the world's largest and most iconic brands including smartphones, tablets, wearables, drones, gaming devices, internet of things, automotive products, and remote controls for smart TVs.

InvenSense is headquartered in San Jose, CA, and has offices in Boston, China, Taiwan, Korea, Japan, France, Canada, Slovakia, and Italy. We're looking for top-notch innovators to join our global team. If you're interested in being a part of our journey and helping us grow to become the leading provider of SoC platform solutions, we want to hear from you.

About the Role

Work in the TDK InvenSense Core Technology Packaging team providing leadership in the areas of package simulation and module level analysis supporting NPI assembly and technology development for all our motion products. The scope of work includes 3D model generation, material characterization, mechanical simulations (static, dynamic, linear, non-linear analyses), thermal and thermomechanical simulations, electromagnetic and coupled Multiphysics simulations. You will be expected to work closely with MEMS design, assembly and validation teams to explore new materials and new assembly methods for MEMS motion sensors. The job will involve close interaction with cross-functional teams across the company, overseas manufacturing houses (OSATs), and as well as close interactions with internal & external customers.

Job Qualifications

  • MS or Ph.D. in Mechanical Engineering, Electrical or MEMS Engineering, Physics, or similar discipline
  • 5+ years of experience with simulation in the field of MEMS, ideally MEMS packaging (e.g. accelerometer, gyroscope, microphone, and magnetometer)
  • Strong expertise in FEM/cross domain/multiphysics simulations (e.g. die/package/socket interactions, thermo-mechanical and electromagnetic simulations)
  • Strong skills in using modeling and simulation, programming and 2D/3D CAD software tools (Ex: Ansys, Comsol, APDL, Matlab, Python, AutoCAD, SolidWorks, Inventor)
  • Ability to analyze/validate, interpret and effectively communicate simulation results to stakeholders both verbally and in presentations
  • Broad knowledge of semiconductor/MEMS materials (including characterization), microelectronics and assembly processes
  • Prefer experience working with suppliers/OSATs, NPI, in high volume manufacturing environment
  • Prefer working knowledge of statistical process control and statistical tolerance analyses
  • Ability to work in an internationally distributed, fast-paced, product focused environment

Possible locations: Milan (Assago), Munich.

  • Advanced Packaging Engineer

    4 giorni fa

    Assago, Italia TDK InvenSense A tempo pieno

    Join to apply for the Advanced Packaging Engineer - Staff role at TDK InvenSense 3 days ago Be among the first 25 applicants Join to apply for the Advanced Packaging Engineer - Staff role at TDK InvenSense Direct message the job poster from TDK InvenSense Founded in 2003, InvenSense Inc., a TDK Group Company, is the world’s leading provider of MEMS sensor...

  • Advanced Packaging Engineer

    13 ore fa

    assago, Italia TDK InvenSense A tempo pieno

    Join to apply for the Advanced Packaging Engineer - Staff role at TDK InvenSense3 days ago Be among the first 25 applicantsJoin to apply for the Advanced Packaging Engineer - Staff role at TDK InvenSenseDirect message the job poster from TDK InvenSenseFounded in 2003, InvenSense Inc., a TDK Group Company, is the world’s leading provider of MEMS sensor...

  • Advanced Packaging Engineer

    2 settimane fa

    Assago, Italia TDK InvenSense A tempo pieno

    Join to apply for the Advanced Packaging Engineer - Staff role at TDK InvenSense 3 days ago Be among the first 25 applicants Join to apply for the Advanced Packaging Engineer - Staff role at TDK InvenSense Direct message the job poster from TDK InvenSense Founded in 2003, InvenSense Inc., a TDK Group Company, is the world’s leading provider of MEMS sensor...

  • Advanced Packaging Engineer

    1 settimana fa

    Assago, Italia Altro A tempo pieno

    Join to apply for theAdvanced Packaging Engineer - Staffrole atTDK InvenSense 3 days ago Be among the first 25 applicants Join to apply for theAdvanced Packaging Engineer - Staffrole atTDK InvenSense Direct message the job poster from TDK InvenSense Founded in 2003, InvenSense Inc., a TDK Group Company, is the world’s leading provider of MEMS sensor...

  • Packaging Engineer

    2 giorni fa

    Assago, Italia CIP4 A tempo pieno

    RUOLO:PACKAGING ENGINEERSETTORE:Personal Care – Cosmetico - DetergentiCHI SIAMOCip4 è una storica azienda italiana leader a livello globale nella produzione di articoli per il personal care (salviettine umide e maschere in tessuto) e l'home care (panni umidi e foglietti cattura colore). L'azienda serve top brand internazionali attraverso soluzioni...

  • Senior Digital Verification Engineer

    3 giorni fa

    Assago, Italia Analog Devices A tempo pieno

    Join to apply for the Senior Analog Verification Engineer role at Analog Devices . Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. With revenue of more than $9 billion in FY24 and approximately 24,000 people globally, ADI ensures today’s...

  • Senior Digital Verification Engineer

    3 settimane fa

    Assago, Italia Altro A tempo pieno

    Join to apply for theSenior Analog Verification Engineerrole atAnalog Devices .Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. With revenue of more than $9 billion in FY24 and approximately 24,000 people globally, ADI ensures today’s...

  • Senior Digital Verification Engineer

    2 settimane fa

    Assago, Italia Altro A tempo pieno

    Join to apply for the Senior Analog Verification Engineer role at Analog Devices . Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. With revenue of more than $9 billion in FY24 and approximately 24,000 people globally, ADI ensures today’s...

  • Principal AI/ML Robotics Perception Architect

    3 settimane fa

    Assago, Italia Analog Devices A tempo pieno

    A leading global technology company in Italy is seeking a Principal AI / ML Software Engineer to drive ML technology strategy and lead cross-functional initiatives. The ideal candidate has a distinguished ML/AI expertise, an advanced understanding of system architecture, and a track record of innovation. This role offers competitive compensation and the...

  • Engineer, Digital Design Engineering

    3 settimane fa

    Assago, Italia Analog Devices A tempo pieno

    Come join Analog Devices (ADI) – a place where Innovation meets Impact. For more than 55 years, Analog Devices has been inventing new breakthrough technologies that transform lives. At ADI you will work alongside the brightest minds to collaborate on solving complex problems that matter from autonomous vehicles, drones and factories to augmented reality...