Lavori attuali relativi a Photonics Packaging Process Engineer - Pisa PI - 2D Photonics
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Photonics Packaging Process Engineer
5 ore fa
Pisa, Italia 2D Photonics A tempo pienoWho are we? At 2D Photonics and CamGraPhIC we develop ultra-high bandwidth, low latency optical interconnects for generative AI, cellular, and high bandwidth data transfer applications. Who are we looking for? We are looking for an engineer with experience in photonic and optoelectronic device packaging to join our R&D team. The ideal candidate combines...
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Photonics Packaging Process Engineer
3 ore fa
Pisa, Italia 2D Photonics A tempo pienoWho are we?At 2D Photonics and CamGraPhIC we develop ultra-high bandwidth, low latency optical interconnects for generative AI, cellular, and high bandwidth data transfer applications.Who are we looking for?We are looking for an engineer with experience in photonic and optoelectronic device packaging to join our R&D team. The ideal candidate combines...
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Photonics Packaging Engineer
3 settimane fa
Pisa, Italia IC Resources A tempo pienoPhotonics Packaging Engineer IC Resources is looking for a Packaging Engineer experienced in photonic and optoelectronic devices to join their R&D team, onsite in Italy. Contact Ella Flynn at IC Resources for more information. Responsibilities Design and develop photonic and optoelectronic packaging solutions Create mechanical and optical component layouts...
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Photonics Packaging Engineer
2 settimane fa
pisa, Italia IC Resources A tempo pienoPhotonics Packaging EngineerIC Resources is looking for a Packaging Engineer experienced in photonic and optoelectronic devices to join their R&D team, onsite in Italy.Contact Ella Flynn at IC Resources for more information.ResponsibilitiesDesign and develop photonic and optoelectronic packaging solutionsCreate mechanical and optical component layoutsSupport...
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Photonics Packaging Engineer
2 settimane fa
pisa, Italia IC Resources A tempo pienoPhotonics Packaging EngineerIC Resources is looking for a Packaging Engineer experienced in photonic and optoelectronic devices to join their R&D team, onsite in Italy.Contact Ella Flynn at IC Resources for more information.ResponsibilitiesDesign and develop photonic and optoelectronic packaging solutionsCreate mechanical and optical component layoutsSupport...
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Photonics Packaging Engineer
57 minuti fa
Pisa, Italia Ic Resources A tempo pienoPhotonics Packaging EngineerIC Resources is looking for a Packaging Engineer experienced in photonic and optoelectronic devices to join their R&D team, onsite in Italy.Contact Ella Flynn at IC Resources for more information.ResponsibilitiesDesign and develop photonic and optoelectronic packaging solutionsCreate mechanical and optical component layoutsSupport...
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Photonics Packaging Engineer
8 ore fa
Pisa, Toscana, Italia IC Resources A tempo pienoOur international start-up client is currently seeking an Engineer with experience in the packaging of photonic and optoelectronic devices to join the R&D team. The successful candidate will be responsible for the design, assembly, and optimisation of advanced photonic packaging solutions, contributing directly to the development of next-generation photonic...
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Photonics Test Engineer
4 ore fa
Pisa (PI), Italia 2D Photonics A tempo pienoPhotonics Test Engineer Location: Pisa, ItalyWho are we looking for?We are seeking an experienced Photonics Test Engineer to join a fast-growing team working on the design and development of cutting-edge transceiver solutions for ultra-high bandwidth, low latency optical interconnects targeting generative AI, cellular, and high bandwidth data transfer...
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Photonics Test Engineer
5 ore fa
Pisa, Italia 2D Photonics A tempo pienoPhotonics Test Engineer Location: Pisa, Italy Who are we looking for? We are seeking an experienced Photonics Test Engineer to join a fast-growing team working on the design and development of cutting-edge transceiver solutions for ultra-high bandwidth, low latency optical interconnects targeting generative AI, cellular, and high bandwidth data transfer...
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Photonics Packaging Engineer for Optoelectronics R&D
2 settimane fa
pisa, Italia IC Resources A tempo pienoA specialized recruiting firm in Italy is seeking a Photonic Packaging Engineer to join their R&D team. The ideal candidate will hold a Master’s degree in Physics or Electronics Engineering and possess knowledge of photonics packaging and CAD design tools. You'll be responsible for designing photonic solutions and supporting assembly processes. This...
Photonics Packaging Process Engineer
4 ore fa
Who are we? At 2D Photonics and CamGraPhIC we develop ultra-high bandwidth, low latency optical interconnects for generative AI, cellular, and high bandwidth data transfer applications. Who are we looking for? We are looking for an engineer with experience in photonic and optoelectronic device packaging to join our R&D team. The ideal candidate combines hands-on technical skills in photonics packaging and semiconductor assembly with a collaborative mindset and a desire to grow within a multidisciplinary, fast-paced development environment. What will you be doing?• Design and develop advanced packaging solutions for photonic and optoelectronic devices with a focus on performance, manufacturability, and reliability • Create and maintain mechanical and optomechanical designs using CAD tools • Support micro-optical and fiber-optic assembly, including precision alignment and optical coupling • Participate in semiconductor assembly processes such as die attach, flip-chip, and wire bonding • Collaborate with optical, electrical, and mechanical engineers on integrated packaging solutions • Support prototyping, testing, process optimisation, and technical documentation • Contribute to continuous improvement and innovation in packaging and assembly workflows What we need to see?• Master's degree in Physics, Electrical Engineering, Electronics, or a related field • Knowledge of photonic and semiconductor packaging concepts • Hands-on experience with micro-optical or fiber-optic assembly processes • Familiarity with semiconductor assembly flows, including flip-chip and wire bonding • Proficiency with CAD tools for mechanical or optomechanical design (e.g. SolidWorks, AutoCAD)• Strong communication skills and ability to work effectively in cross-functional teams
