Photonics Packaging Process Engineer

14 ore fa

Pisa pi, Italia 2D Photonics A tempo pieno

Who are we? At 2 D Photonics and Cam Gra Ph IC we develop ultra-high bandwidth, low latency optical interconnects for generative AI, cellular, and high bandwidth data transfer applications. Who are we looking for? We are looking for an engineer with experience in photonic and optoelectronic device packaging to join our R& D team. The ideal candidate combines hands-on technical skills in photonics packaging and semiconductor assembly with a collaborative mindset and a desire to grow within a multidisciplinary, fast-paced development environment. What will you be doing? • Design and develop advanced packaging solutions for photonic and optoelectronic devices with a focus on performance, manufacturability, and reliability • Create and maintain mechanical and optomechanical designs using CAD tools • Support micro-optical and fiber-optic assembly, including precision alignment and optical coupling • Participate in semiconductor assembly processes such as die attach, flip-chip, and wire bonding • Collaborate with optical, electrical, and mechanical engineers on integrated packaging solutions • Support prototyping, testing, process optimisation, and technical documentation • Contribute to continuous improvement and innovation in packaging and assembly workflows What we need to see? • Master’s degree in Physics, Electrical Engineering, Electronics, or a related field • Knowledge of photonic and semiconductor packaging concepts • Hands-on experience with micro-optical or fiber-optic assembly processes • Familiarity with semiconductor assembly flows, including flip-chip and wire bonding • Proficiency with CAD tools for mechanical or optomechanical design (e.g. Solid Works, Auto CAD) • Strong communication skills and ability to work effectively in cross-functional teams

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