Photonics Packaging Engineer

1 settimana fa


Pisa, Italia Ic Resources A tempo pieno

Our international start-up client is currently seeking an Engineer with experience in the packaging of photonic and optoelectronic devices to join the R&D team. The successful candidate will be responsible for the design, assembly, and optimization of advanced photonic packaging solutions, contributing directly to the development of next-generation photonic systems. The ideal candidate combines strong technical expertise in photonics packaging and semiconductor assembly with excellent communication and teamwork skills, and thrives in a collaborative, cross-functional environment. This position is suited for an engineer with some professional experience who is motivated to grow within a multidisciplinary team.Required skills for the Photonic Packaging Engineering will include:Knowledge of semiconductor and photonics packaging conceptsFamiliarity with semiconductor assembly processes, including flip-chip and wire-bonding manufacturing flowsExperience working in a cleanroom or precision assembly environmentStrong verbal and written communication skillsMaster's degree in Physics, Electrical Engineering, Electronics Engineering, or related fieldPlease contact Rachel Anderson for further details.



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  • pisa, Italia IC Resources A tempo pieno

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  • Pisa, Italia Ic Resources A tempo pieno

    Our international start-up client is currently seeking an Engineer with experience in the packaging of photonic and optoelectronic devices to join the R& D team.The successful candidate will be responsible for the design, assembly, and optimization of advanced photonic packaging solutions, contributing directly to the development of next-generation photonic...


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